Kontron COMe Starterkit Eval T2 Manual de usuario Pagina 185
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- Tabla de contenidos
- MARCADORES
Valorado. / 5. Basado en revisión del cliente
Carrier Board PCB Layout Guidelines
6.5.5. SDVO Trace Routing Guidelines
Table 64: SDVO Trace Routing Guidelines
Parameter Trace Routing
Transfer Rate / SDVO Lane Up to 2.0 GBit/s
Maximum signal line length
(coupled traces)
7 inches
Signal length used on COM Express Module
(including the Carrier Board connector)
2 inches
Signal length allowance for the COM Express Carrier
Board
5 inches to SDVO device
Differential Impedance 100 Ω +/-20%
Single-ended Impedance 55 Ω +/-15%
Trace width (W) PCB stack-up dependent
Spacing between differential pairs (intra-pair) (S) PCB stack-up dependent
Spacing between pairs-to-pair Min. 20mils
Spacing between differential pairs and high-speed
periodic signals
Min. 50mils
Spacing between differential pairs and low-speed non
periodic signals
Min. 20mils
Length matching between differential pairs
(intra-pair)
Max. 5mils
Length matching between differential pairs
(inter-pair)
Keep difference within a 2.0 inch delta.
Length matching between differential signal pair and
differential clock pair
Max. 5mils
Spacing from edge of plane Min. 40mils
Via Usage Max. 4 vias per differential signal trace
AC coupling capacitors AC coupling capacitors on the signals 'SDVO_INT+' and
'SDVOINT-' have to be implemented on the customer COM
Express Carrier Board, if the device is directly located on the
Carrier Board. When using a slot at the Carrier Board the
capacitors are located at the addon card.
Capacitor type: X7R, 100nF +/-10%, 16V, shape 0402.
PICMG
®
COM Express
®
Carrier Board Design Guide Rev. 2.0 / December 6, 2013
185/218
- COM Express® 1
- Carrier Design Guide 1
- Contents 3
- 1. Preface 8
- 1.6. Name and logo usage 9
- 1.7. Intellectual property 10
- Term Description 11
- 1.10. Schematic Conventions 15
- 2. COM Express Interfaces 16
- COM Expre ss Module 17
- Type 10 17
- Table 4: Pin-out Comparison 20
- , the PCI 30
- 2.3.5. Schematic Examples 34
- Signal Pin Description I/O 45
- Figure 15: ExpressCard Size 45
- 2.4.1. Signal Definitions 48
- 2.4.2. PEG Configuration 49
- 2.4.3. Reference Schematics 52
- DisplayPort is supported 55
- DisplayPort Example 56
- Figure 21: HDMI Example 57
- Figure 22: DVI Example 59
- SDVO Port Configuration 61
- Supported SDVO Devices 62
- DVI_SDAROM 63
- DVI_SCLROM 63
- SDVO I2C Bus Address 63
- Write = 0111 0000 (70h) 63
- Read = 0111 0001 (71h) 63
- 2.6.1. Signal Definitions 66
- Earliest asserted 1ms after 68
- 3.3V, 5V and 12V are stable 68
- 2.7. LAN 70
- 2.7.2. Reference Schematics 73
- 2.8. USB Ports 76
- 2.8.2. Reference Schematics 77
- 2.9. USB 3.0 81
- 2.9.1.3. USB 3.0 connector 83
- 2.9.2. Reference Schematics 84
- 2.10. SATA 87
- Pins Signal Description 88
- SATA Port 89
- 2.11. LVDS 91
- Term Definition 94
- 2.11.2. Reference Schematics 97
- 2.12.1. Signal Definitions 99
- 2.12.2. Reference Schematics 100
- 2.13. VGA 101
- COM Express Interfaces 102
- 2.14. TV-Out 104
- COM Express Module 106
- AUDIO POWER 107
- AUDIO CODEC - ALC888 107
- ANALOG I/O CONNECTOR 107
- 2.15.1.2. AC'97 108
- Figure 41: Audio Amplifier 109
- 2.16.1. Signal Definition 111
- SUPER I/O 115
- COM1/COM2 116
- 2.17.1. Signal Definition 118
- 2.18.1. Signal Definitions 121
- 2.18.2. Reference Schematics 121
- 2.19.1. Signal Definitions 123
- 2.20.1. Signal Definitions 125
- C O M 1 C O M 2 126
- 2.21. CAN Interface 127
- 2.21.2. Reference Schematics 128
- 2.22. Miscellaneous Signals 129
- POWER ATX 133
- POWER AT 133
- Type 2 Detection 133
- 2.22.5. Watchdog Timer 137
- G P IO C o n n e c t o r 141
- 2.22.8. Fan Connector 142
- 2.22.9. Thermal Interface 143
- 2.23. PCI Bus 147
- 2.23.2. Reference Schematics 148
- 2.24.1. Signal Definitions 153
- 3. Power and Reset 156
- 3.2.1. ATX vs AT Supplies 157
- 3.2.2. Power States 157
- Power and Reset 158
- 3.2.5. Power Button 162
- 3.4. Reference Schematics 164
- Table 55: ATX Signal Names 166
- ATX Signal Name Description 166
- 3.5. Routing Considerations 167
- 3.5.3. VCC5_SBY Routing 168
- 4. BIOS Considerations 170
- Type Height Partnumber Note 171
- COM Express Module Connectors 172
- GND Plane 173
- Power Plane 173
- COM Express 175
- Table 60: Trace Parameters 176
- Symbol Definition 176
- Carrier Board 178
- Parameter Trace Routing 183
- Extended 194
- 7.2. Heatspreader 195
- (Ø2.7mm bore hole) 196
- (M2.5 thread) 196
- (Ø2.7 bore hole) 197
- Mechanical Considerations 198
- 8.3. Useful books 202
- 9.1. TV-Out 203
- 9.1.5. Signal Termination 206
- 9.1.6. Video Filter 206
- 9.1.7. ESD Protection 206
- 9.2. LPC Firmware Hub 207
- Appendix C: List of Tables 213
- Appendix D: List of Figures 215
- Table 79: Revision History 217
- Revision Date Author Changes 217
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