Kontron COMe Starterkit Eval T2 Manual de usuario Pagina 182
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- MARCADORES
Valorado. / 5. Basado en revisión del cliente
Carrier Board PCB Layout Guidelines
6.5.1. PCI Express Trace Routing Guidelines
Table 61: PCI Express Trace Routing Guidelines
Parameter PCIe Gen1 PCIe Gen2 PCIe Gen3
Symbol Rate / PCIe Lane 2.5 G Symbols/s 5.0 G Symbols/s 8.0 G Symbols/s
Maximum signal line length
(coupled traces) TX and RX
21.0 inches 21.0 inches 14.0 inches
Signal length allowance on the COM
Express Carrier Board to PCIe device
15.85 inches
15.85 inches
10.0 inches
Signal length allowance on the COM
Express Carrier Board to PCIe slot
9.00 inches 9.00 inches 4.0 inches
PCI-SIG: Differential impedance
recommendation
100 Ω +/-20% 85 Ω +/-15% 85 Ω +/-15%
COMCDG Rev. 1.0: Differential
impedance recommendation for a
GEN1 and GEN2 design
92 Ω +/-10% -
COMCDG Rev. 2.0: Differential
impedance recommendation for
new Carrier designs
85 Ω +/-15%
Single-ended Impedance 55 Ω +/-15% 50 Ω +/-15% 50 Ω +/-15%
Trace width (W) PCB stack-up dependent PCB stack-up dependent PCB stack-up dependent
Spacing between differential pairs
(intra-pair) (S)
PCB stack-up dependent PCB stack-up dependent PCB stack-up dependent
Spacing between RX and TX pairs
(inter-pair) (s)
Min. 20mils Min. 20mils Min. 20mils
Spacing between differential pairs and
high-speed periodic signals
Min. 50mils Min. 50mils Min. 50mils
Spacing between differential pairs and
low-speed non periodic signals
Min. 20mils Min. 20mils Min. 20mils
Length matching between differential
pairs (intra-pair)
Max. 5mils Max. 5mils Max. 5mils
Length matching between RX and TX
pairs (inter-pair)
No strict electrical requirements.
Keep difference within a 3.0
inch delta to minimize latency.
No strict electrical requirements.
Keep difference within a 3.0 inch
delta to minimize latency.
No strict electrical requirements.
Keep difference within a 3.0
inch delta to minimize latency.
Length matching between reference
clock differential pairs REFCLK+ and
REFCLK-
(intra-pair)
Max. 5mils Max. 5mils Max. 5mils
Length matching between reference
clock pairs (inter-pair)
No electrical requirements. No electrical requirements. No electrical requirements.
Reference plane GND referenced preferred GND referenced preferred GND referenced preferred
Spacing from edge of plane Min. 40mils Min. 40mils Min. 40mils
Via Usage Max. 2 vias per TX trace
Max. 4 vias per RX trace
Max. 2 vias per TX trace
Max. 4 vias per RX trace
Max. 2 vias / TX
Max. 4 vias / RX (to device)
Max. 2 vias / RX (to slot)
AC coupling capacitors The AC coupling capacitors for
the TX lines are incorporated on
the COM Express Module.
The AC coupling capacitors for
RX signal lines have to be
implemented on the customer
COM Express Carrier Board.
Capacitor type: X7R, 100nF +/-
10%, 16V, shape 0402.
The AC coupling capacitors for
the TX lines are incorporated on
the COM Express Module.
The AC coupling capacitors for
RX signal lines have to be
implemented on the customer
COM Express Carrier Board.
Capacitor type: X7R, 100nF +/-
10%, 16V, shape 0402.
The AC coupling capacitors for
the TX lines are incorporated on
the COM Express Module.
The AC coupling capacitors for
RX signal lines have to be
implemented on the customer
COM Express Carrier Board.
Capacitor type: X7R, 200nF +/-
10%, 16V, shape 0402.
PICMG
®
COM Express
®
Carrier Board Design Guide Rev. 2.0 / December 6, 2013
182/218
- COM Express® 1
- Carrier Design Guide 1
- Contents 3
- 1. Preface 8
- 1.6. Name and logo usage 9
- 1.7. Intellectual property 10
- Term Description 11
- 1.10. Schematic Conventions 15
- 2. COM Express Interfaces 16
- COM Expre ss Module 17
- Type 10 17
- Table 4: Pin-out Comparison 20
- , the PCI 30
- 2.3.5. Schematic Examples 34
- Signal Pin Description I/O 45
- Figure 15: ExpressCard Size 45
- 2.4.1. Signal Definitions 48
- 2.4.2. PEG Configuration 49
- 2.4.3. Reference Schematics 52
- DisplayPort is supported 55
- DisplayPort Example 56
- Figure 21: HDMI Example 57
- Figure 22: DVI Example 59
- SDVO Port Configuration 61
- Supported SDVO Devices 62
- DVI_SDAROM 63
- DVI_SCLROM 63
- SDVO I2C Bus Address 63
- Write = 0111 0000 (70h) 63
- Read = 0111 0001 (71h) 63
- 2.6.1. Signal Definitions 66
- Earliest asserted 1ms after 68
- 3.3V, 5V and 12V are stable 68
- 2.7. LAN 70
- 2.7.2. Reference Schematics 73
- 2.8. USB Ports 76
- 2.8.2. Reference Schematics 77
- 2.9. USB 3.0 81
- 2.9.1.3. USB 3.0 connector 83
- 2.9.2. Reference Schematics 84
- 2.10. SATA 87
- Pins Signal Description 88
- SATA Port 89
- 2.11. LVDS 91
- Term Definition 94
- 2.11.2. Reference Schematics 97
- 2.12.1. Signal Definitions 99
- 2.12.2. Reference Schematics 100
- 2.13. VGA 101
- COM Express Interfaces 102
- 2.14. TV-Out 104
- COM Express Module 106
- AUDIO POWER 107
- AUDIO CODEC - ALC888 107
- ANALOG I/O CONNECTOR 107
- 2.15.1.2. AC'97 108
- Figure 41: Audio Amplifier 109
- 2.16.1. Signal Definition 111
- SUPER I/O 115
- COM1/COM2 116
- 2.17.1. Signal Definition 118
- 2.18.1. Signal Definitions 121
- 2.18.2. Reference Schematics 121
- 2.19.1. Signal Definitions 123
- 2.20.1. Signal Definitions 125
- C O M 1 C O M 2 126
- 2.21. CAN Interface 127
- 2.21.2. Reference Schematics 128
- 2.22. Miscellaneous Signals 129
- POWER ATX 133
- POWER AT 133
- Type 2 Detection 133
- 2.22.5. Watchdog Timer 137
- G P IO C o n n e c t o r 141
- 2.22.8. Fan Connector 142
- 2.22.9. Thermal Interface 143
- 2.23. PCI Bus 147
- 2.23.2. Reference Schematics 148
- 2.24.1. Signal Definitions 153
- 3. Power and Reset 156
- 3.2.1. ATX vs AT Supplies 157
- 3.2.2. Power States 157
- Power and Reset 158
- 3.2.5. Power Button 162
- 3.4. Reference Schematics 164
- Table 55: ATX Signal Names 166
- ATX Signal Name Description 166
- 3.5. Routing Considerations 167
- 3.5.3. VCC5_SBY Routing 168
- 4. BIOS Considerations 170
- Type Height Partnumber Note 171
- COM Express Module Connectors 172
- GND Plane 173
- Power Plane 173
- COM Express 175
- Table 60: Trace Parameters 176
- Symbol Definition 176
- Carrier Board 178
- Parameter Trace Routing 183
- Extended 194
- 7.2. Heatspreader 195
- (Ø2.7mm bore hole) 196
- (M2.5 thread) 196
- (Ø2.7 bore hole) 197
- Mechanical Considerations 198
- 8.3. Useful books 202
- 9.1. TV-Out 203
- 9.1.5. Signal Termination 206
- 9.1.6. Video Filter 206
- 9.1.7. ESD Protection 206
- 9.2. LPC Firmware Hub 207
- Appendix C: List of Tables 213
- Appendix D: List of Figures 215
- Table 79: Revision History 217
- Revision Date Author Changes 217
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