Kontron COMe Starterkit Eval T2 Manual de usuario descargar pdf (Pagina 173)

Carrier Board PCB Layout Guidelines

6. Carrier Board PCB Layout Guidelines

6.1. General

6.2. PCB Stack-ups

Note Section 6 'Carrier Board PCB Layout Guidelines' assumes a thickness for the

carrier PCB to be 0.0625 inches. Other PCB mechanics are possible but the

described Stack-ups need to be adapted.

6.2.1. Four-Layer Stack-up

Figure 68: Four-Layer Stack-up

Figure 68 above is an example of a four layer stack-up. Layers L1 and L4 are used for signal

routing.

Layers L2 and L3 are used for solid ground and power planes respectively.

Microstrips on Layers 1 and 4 reference ground and power planes on Layers 2 and 3

respectively.

In some cases, it may be advantageous to swap the GND and PWR planes. This allows Layer 4

to be GND referenced. Layer 4 is clear of parts and may be the preferred primary routing layer.

6.2.2. Six-Layer Stack-up

Figure 69: Six-Layer Stack-up

PICMG

COM Express

Carrier Board Design Guide Rev. 2.0 / December 6, 2013

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GND Plane

Power Plane

GND Plane

L 1

L 2

L 3

L 4

L 5

L 6

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Kontron COMe Starterkit Eval T2 Manual de usuario Pagina 173