Kontron COMe-cHL6 Manual de usuario Pagina 90
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COMe-cHL6 / BIOS Operation
IGD Configuration
Feature Options Description
IGD - Boot Type
Auto
CRT
EFP
LFP
EFP3
EFP2
Select the Integrated Graphics Video Device which will
be activated during POST
IGD - Secondary Boot Type
Disabled
CRT
EFP
LFP
EFP3
EFP2
Select the second Video Device which will be activated
during POST
LFP Type
AUTO
VGA 640×480 1×18
WVGA 800×480 1×18
SVGA 800×600 1×18
XGA 1024×768 1×18
XGA 1024×768 1×24
WXGA 1280×768 1×24
WXGA 1280×800 1×18
WXGA 1366×768 1×24
WXGA+ 1440×900 2×18
WXGA+ 1440×900 2×24
SXGA 1280×1024 2×18
SXGA 1280×1024 2×24
WSXGA+ 1680×1050 2×18
WSXGA+ 1680×1050 2×24
UXGA 1600×1200 2×18
UXGA 1600×1200 2×24
WUXGA 1920×1200 2×18
WUXGA 1920×1200 2×24
Custom
Select LFP used by Internal Graphics Device by selecting
the appropriate panel setup item
Backlight Control None/External
PWM
PWM Inverted
I2C
Backlight Control Setting
Backlight Value
128
Set LCD backlight brightness (0-255)
eDP Panel Type
LVDS
eDP
Select Panel Type connected to eDP Port (eDP only
available with customized hardware)
LVDS Clock Center Spreading
No Spreading
0.5%
1.0%
1.5%
2.0%
2.5%
Select LVDS clock frequency center spreading depth
EFP1 Type DisplayPort Only Integrated HDMI/DisplayPort Configuration with
90
- COMe-cHL6 1
- » Table of Contents « 3
- 1 User Information 5
- 1.5 Warranty 6
- 1.6 Technical Support 6
- 2 Introduction 7
- 2.2 Naming clarification 8
- 2.5 COM Express® Benefits 9
- 3 Product Specification 10
- 3.2 Functional Specification 11
- Graphics Core 15
- Connectivity 16
- Misc Interfaces and Features 17
- Kontron Features 17
- Additional features 17
- Power Features 17
- 3.3 Block Diagram 18
- 3.4 Accessories 19
- 3.5 Electrical Specification 20
- 3.5.5 ATX Mode 21
- 3.5.6 Single Supply Mode 21
- 3.6 Power Control 22
- 3.7.2 Humidity 23
- WEEE Directive 24
- Conformal Coating 24
- Shock & Vibration 25
- 3.9 MTBF 26
- 3.10 Mechanical Specification 27
- 3.11 Module Dimensions 28
- 4 Features and Interfaces 30
- 4.4 SPI boot 32
- Using an external SPI flash 33
- 4.5 M.A.R.S 34
- 4.6 UART 35
- 4.7 Fast I2C 36
- Time-out events 37
- WDT Signal 37
- 4.10 Speedstep Technology 40
- 4.11 C-States 41
- 4.12 Hyper Threading 42
- 4.14 Display Configuration 44
- DDI Design Consideration 46
- DVI-I Design Topology 46
- Requirements 47
- Setup a Multi-monitor system 47
- 4.16 Intel® vPro™ technology 48
- 5 System Resources 50
- 5.2 Memory Area 51
- 5.3 I/O Address Map 51
- 5.5 Internal I2C Bus 52
- 5.6 External I2C Bus 52
- 6 Connectors 54
- 7 Pinout List 55
- 7.2 Connector X1A Row A 56
- COMe-cHL6 / Pinout List 57
- 7.3 Connector X1A Row B 58
- 7.4 Connector X1B Row C 60
- 7.5 Connector X1B Row D 62
- 8 BIOS Operation 64
- 8.4 Setup Guide 65
- 8.5 BIOS Setup 66
- System Information 67
- Boot Features 68
- Network Stack 70
- Platform Information 71
- 8.5.2 Advanced 72
- Silicon Information 73
- Processor Configuration 74
- Processor Power Management 75
- Miscellaneous 77
- I2C Speed 78
- Watchdog 79
- Generic LPC Decode Ranges 80
- H/W Monitor 81
- HDD Configuration 83
- Memory Configuration 86
- Graphics Configuration 89
- IGD Configuration 90
- South Bridge Configuration 92
- SB PCI Express Config 93
- PCI Express Root Port 1/2/3/4 94
- SB USB Config 95
- SB Azalia Config 96
- Network Configuration 97
- CPLD Configuration 98
- LPC SIO Configuration 99
- ME Configuration 100
- Thermal Configuration 101
- CPU Thermal Configuration 102
- COMe-cHL6 / BIOS Operation 103
- Passive Cooling 104
- ICC Configuration 105
- Intel® Rapid Start Technology 107
- 8.5.3 Security 109
- Security 110
- 8.5.4 Boot 111
- 8.5.5 Exit 112
- Corporate Offices 113
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