Kontron COMe-cHL6 Manual de usuario Pagina 76
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COMe-cHL6 / BIOS Operation
Lock TDP Settings
Disabled
Enabled
Lock TDP in MSR_CONFIG_TDP_CONTROL
C-States
Enabled
Disabled
Enable processor idle power saving states
- Extend C-States
Enabled
Disabled
Enable C-State transitions to occur in combination with
P-States
- C3 State
Enabled
Disabled
Enable processor idle power saving C3 state
- C6 State
Enabled
Disabled
Enable processor idle power saving C6 state
- C6 Latency
Short
Long
Configure Short/Long latency
- C7 State Disabled
C7
C7s
Enable processor idle power saving C7 state
- C7 Latency
Short
Long
Configure Short/Long latency
- C-State Auto Demotion Disabled
C1
C3
C1 and C3
Configure C-State Auto Demotion
- C-State Auto UnDemotion Disabled
C1
C3
C1 and C3
Configure C-State Auto UnDemotion
- Package C-State Demotion
Disabled
Enabled
Enable/Disable Package C-State Demotion
- Package C-State UnDemotion
Disabled
Enabled
Enable/Disable Package C-State UnDemotion
- C-State Pre-Wake
Enabled
Disabled
Enable/Disable C-State Pre-Wake
76
- COMe-cHL6 1
- » Table of Contents « 3
- 1 User Information 5
- 1.5 Warranty 6
- 1.6 Technical Support 6
- 2 Introduction 7
- 2.2 Naming clarification 8
- 2.5 COM Express® Benefits 9
- 3 Product Specification 10
- 3.2 Functional Specification 11
- Graphics Core 15
- Connectivity 16
- Misc Interfaces and Features 17
- Kontron Features 17
- Additional features 17
- Power Features 17
- 3.3 Block Diagram 18
- 3.4 Accessories 19
- 3.5 Electrical Specification 20
- 3.5.5 ATX Mode 21
- 3.5.6 Single Supply Mode 21
- 3.6 Power Control 22
- 3.7.2 Humidity 23
- WEEE Directive 24
- Conformal Coating 24
- Shock & Vibration 25
- 3.9 MTBF 26
- 3.10 Mechanical Specification 27
- 3.11 Module Dimensions 28
- 4 Features and Interfaces 30
- 4.4 SPI boot 32
- Using an external SPI flash 33
- 4.5 M.A.R.S 34
- 4.6 UART 35
- 4.7 Fast I2C 36
- Time-out events 37
- WDT Signal 37
- 4.10 Speedstep Technology 40
- 4.11 C-States 41
- 4.12 Hyper Threading 42
- 4.14 Display Configuration 44
- DDI Design Consideration 46
- DVI-I Design Topology 46
- Requirements 47
- Setup a Multi-monitor system 47
- 4.16 Intel® vPro™ technology 48
- 5 System Resources 50
- 5.2 Memory Area 51
- 5.3 I/O Address Map 51
- 5.5 Internal I2C Bus 52
- 5.6 External I2C Bus 52
- 6 Connectors 54
- 7 Pinout List 55
- 7.2 Connector X1A Row A 56
- COMe-cHL6 / Pinout List 57
- 7.3 Connector X1A Row B 58
- 7.4 Connector X1B Row C 60
- 7.5 Connector X1B Row D 62
- 8 BIOS Operation 64
- 8.4 Setup Guide 65
- 8.5 BIOS Setup 66
- System Information 67
- Boot Features 68
- Network Stack 70
- Platform Information 71
- 8.5.2 Advanced 72
- Silicon Information 73
- Processor Configuration 74
- Processor Power Management 75
- Miscellaneous 77
- I2C Speed 78
- Watchdog 79
- Generic LPC Decode Ranges 80
- H/W Monitor 81
- HDD Configuration 83
- Memory Configuration 86
- Graphics Configuration 89
- IGD Configuration 90
- South Bridge Configuration 92
- SB PCI Express Config 93
- PCI Express Root Port 1/2/3/4 94
- SB USB Config 95
- SB Azalia Config 96
- Network Configuration 97
- CPLD Configuration 98
- LPC SIO Configuration 99
- ME Configuration 100
- Thermal Configuration 101
- CPU Thermal Configuration 102
- COMe-cHL6 / BIOS Operation 103
- Passive Cooling 104
- ICC Configuration 105
- Intel® Rapid Start Technology 107
- 8.5.3 Security 109
- Security 110
- 8.5.4 Boot 111
- 8.5.5 Exit 112
- Corporate Offices 113
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