Kontron COMe-bHL6 Manual de usuario Pagina 16
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Valorado. / 5. Basado en revisión del cliente
COMe-bHL6 / Product Specification
Memory
Sockets
2x DDR3 SO-DIMM
Memory Type
DDR3L-1600 (ECC on RXT Ver.)
Maximum Size
2x8GB
Technology
Dual Channel
Chipset
The 32nm Intel® 8-Series Platform Controller Hub Lynx Point supports:
» PCI Express Revision 2.0
» PCI Express Configurations x1, x2, x4
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Trusted Execution Technology (TXT)
» Intel® vPro Technology (optional)
» Intel® Active Management Technology 9.0 (optional)
» Intel® Anti-Theft Technology
» Intel® Rapid Storage Technology
» Intel® Smart Response Technology
PCH comparison
Feature QM87 HM86
TDP 2.7W 2.7W
USB 3.0 (USB 2.0 compatible) YES (4x on COMe) YES (2x on COMe)
USB 2.0 YES (4x on COMe) YES (6x on COMe)
SATA 6Gb/s (Gen3) YES (3x on COMe) YES (2x on COMe)
SATA 3Gb/s (Gen2) YES (1x on COMe) YES (2x on COMe)
Wireless Display YES YES
3 Displays simultaneously YES YES
Rapid Storage AHCI, RAID 0/1/5/10 AHCI only
VT-d YES NO
vPRO YES with custom BIOS NO
AMT YES with custom BIOS NO
TXT YES with custom BIOS NO
The Intel® vPro Technology including Trusted Execution Technology (TXT), Active
Management Technology (AMT) and Encryption AES-NI is not supported by default on
COMe-bHL6. Please contact your local sales or support for custom BIOS variants supporting
vPro.
16
- COMe-bHL6 1
- » Table of Contents « 3
- 1 User Information 6
- 1.5 Warranty 7
- 1.6 Technical Support 7
- 2 Introduction 8
- COMe-bHL6 / Introduction 9
- 2.5 COM Express® Benefits 10
- 3 Product Specification 11
- 3.2 Functional Specification 12
- CPU Features 14
- PCH comparison 16
- Graphics Core 17
- PEG Configuration 18
- Connectivity 19
- Misc Interfaces and Features 19
- Kontron Features 20
- Additional features 20
- Power Features 20
- 3.3 Block Diagram 21
- 3.4 Accessories 22
- 3.5 Electrical Specification 23
- 3.5.5 ATX Mode 24
- 3.5.6 Single Supply Mode 24
- 3.6 Power Control 25
- 3.7.2 Humidity 26
- WEEE Directive 27
- Conformal Coating 27
- Shock & Vibration 28
- 3.9 MTBF 29
- 3.10 Mechanical Specification 30
- 3.11 Module Dimensions 31
- 3.13 Onboard Connectors 33
- 4 Features and Interfaces 35
- 4.2 Rapid Shutdown 36
- 4.5 SPI boot 39
- Using an external SPI flash 40
- 4.6 M.A.R.S 41
- 4.7 UART 42
- 4.8 Fast I2C 43
- Time-out events 44
- WDT Signal 44
- 4.11 Speedstep Technology 47
- 4.12 C-States 48
- 4.13 Hyper Threading 49
- 4.15 VID-x 51
- 4.17 Display Configuration 53
- 3 independent Display Support 54
- DDI Design Consideration 55
- DVI-I Design Topology 55
- Requirements 56
- Setup a Multi-monitor system 56
- 4.19 Intel® Wireless Display 57
- 4.20 Intel® vPro™ technology 59
- 5 System Resources 61
- 5.2 Memory Area 62
- 5.3 I/O Address Map 62
- 5.5 Internal I2C Bus 63
- 5.6 External I2C Bus 63
- 6 Connectors 65
- 7 Pinout List 66
- 7.2 Connector X1A Row A 67
- COMe-bHL6 / Pinout List 68
- 7.3 Connector X1A Row B 69
- 7.4 Connector X1B Row C 71
- 7.5 Connector X1B Row D 73
- 8 BIOS Operation 75
- 8.5 BIOS Setup 76
- System Information 78
- Boot Features 79
- Network Stack 81
- Platform Information 82
- 8.5.2 Advanced 83
- Silicon Information 84
- Processor Configuration 85
- Processor Power Management 86
- Miscellaneous 88
- I2C Speed 89
- Watchdog 90
- Generic LPC Decode Ranges 91
- H/W Monitor 92
- HDD Configuration 94
- Memory Configuration 96
- Graphics Configuration 99
- COMe-bHL6 / BIOS Operation 100
- IGD Configuration 101
- PEG Port Configuration 103
- South Bridge Configuration 105
- SB PCI Express Config 106
- SB USB Config 108
- SB Azalia Config 109
- Network Configuration 110
- CPLD Configuration 111
- LPC SIO Configuration 112
- ME Configuration (default) 115
- Thermal Configuration 117
- CPU Thermal Configuration 118
- Passive Cooling 120
- ICC Configuration 121
- Intel® Rapid Start Technology 123
- 8.5.3 Security 125
- Security 126
- 8.5.4 Boot 127
- 8.5.5 Exit 128
- Corporate Offices 129
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