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COMe-cDC2 / Product Specification
3 Product Specification
3.1 Modules & Accessories
The COM Express® compact sized Computer-on-Module COMe-cDC2 (UNP1) follows pin-out Type 2 and is compatible to
PICMG specification COM.0 Rev 1.0. The COMe-cDC2 based on Intel's Navy Pear platform is available in different variants:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor Chipset and Features
36005-0000-16-2 COMe-cDC2 N270 Intel® Atom™ N270 DDR2, 945GSE
36005-0040-16-2 COMe-cDC2 N270 4GB Intel® Atom™ N270 DDR2, 945GSE, 4GB SSD
Extended temperature modules (E1, -25°C to +75°C operating)
Product Number Product Name Processor Chipset and Features
36005-0000-16-2EXT COMe-cDC2 N270 E1 Intel® Atom™ N270 DDR2, 945GSE, E1
36005-0040-16-2EXT COMe-cDC2 N270 4GB E1 Intel® Atom™ N270 DDR2, 945GSE, 4GB SSD, E1
10
- COMe-cDC2 1
- » Table of Contents « 3
- 1 User Information 6
- 1.5 Warranty 7
- 1.6 Technical Support 7
- 2 Introduction 8
- 2.5 COM Express® Benefits 9
- 3 Product Specification 10
- Accessories 11
- 3.2 Functional Specification 12
- Connectivity 13
- Misc Interfaces and Features 14
- Kontron Features 14
- Power Features 14
- Supported Operating Systems 14
- 3.3 Block Diagram 15
- 3.4 Electrical Specification 16
- 3.4.5 ATX Mode 17
- 3.4.6 Single Supply Mode 17
- 3.5 Power Control 18
- 3.6.2 Humidity 19
- CE marking 20
- WEEE Directive 20
- Conformal Coating 20
- Shock & Vibration 21
- 3.8 MTBF 22
- 3.9 Mechanical Specification 23
- 3.10 Thermal Management 24
- 3.11 Heatspreader 24
- 3.12 Onboard Fan Connector 25
- 4 Features and Interfaces 27
- 4.2 S5 Eco Mode 28
- 4.4 LPC boot 30
- 4.5 M.A.R.S 31
- 4.6 Fast I2C 32
- 4.7 JIDA16 and JIDA32 33
- 4.8 K-Station 1 34
- 4.9.1 I2C 35
- 4.9.2 Storage 35
- 4.9.3 GPIO 35
- 4.9.4 Hardware Monitor 35
- 4.10.1 I2C 35
- 4.10.2 Storage 36
- 4.10.3 GPIO 36
- 4.10.5 SIO Winbond 83627DHGP 36
- 4.10.6 SIO Winbond 83627HG 37
- Configuration 38
- Time-out events 39
- WDT Signal 39
- 4.13 Flash Backup Feature 40
- 4.14 Speedstep Technology 42
- 4.15 C-States 43
- 4.16 Hyper Threading 44
- 5 System Ressources 46
- 5.3 Memory Area 47
- 5.4 I/O Address Map 48
- 5.7 JILI I2C Bus 48
- 6 Connectors 49
- 6.2 Pinout List 50
- 6.2.2 Connector X1A Row A 51
- COMe-cDC2 / Connectors 52
- 6.2.3 Connector X1A Row B 53
- 6.2.4 Connector X1B Row C 55
- 6.2.5 Connector X1B Row D 57
- 7 BIOS Operation 59
- 7.3 Setup Guide 60
- 7.4 BIOS Setup 62
- 7.4.2 Module Info 63
- Module Software Revisions 64
- Current LVDS Configuration 64
- 7.4.3 Advanced Menu 65
- CPU Configuration 66
- IDE Configuration 67
- IDE Device Submenu 68
- SuperIO Configuration 69
- ACPI Settings 70
- ACPI Cooling Options 71
- PCI Express Configuration 73
- USB Configuration 74
- COMe-cDC2 / BIOS Operation 75
- Hardware Health 76
- Module Hardware Health 77
- Baseboard Hardware Health 78
- Miscellaneous Settings 79
- MARS Interface Configuration 80
- Watchdog 81
- Remote Access Configuration 82
- LAN Controller 83
- GPIO Level Configuration 84
- Trusted Computing 85
- 7.4.4 PCIPnP Menu 86
- 7.4.5 Boot 87
- Boot Setting Configuration 88
- 7.4.6 Security 89
- 7.4.7 Chipset 90
- North Bridge Configuration 91
- Display Control 92
- Internal LVDS Configuration 93
- Southbridge Configuration 94
- LPC Decode Range 95
- 7.4.8 Exit Menu 96
- Corporate Offices 97
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